Micron-Scale Precision Without Mechanical Tool Wear
Scantech Laser’s industrial laser drilling systems utilize ultra-short pulse laser beams (fiber, nanosecond, picosecond, and femtosecond) to vaporize material cleanly with controlled thermal impact. Designed for high-aspect-ratio micro-holes, our machines eliminate mechanical drill bit breakage and tool wear while delivering consistent roundness and minimal taper across millions of cycles.
Non-Contact Thermal Processing
Eliminates mechanical stress and workpiece deflection, making it suitable for ultra-thin foils, superalloys, brittle ceramics, and flexible polymers.
High Aspect Ratio & Micro-Diameters
Drills micro-vias and cooling holes down to 10 microns in diameter with aspect ratios up to 1:50, controlled by advanced beam shaping optics.
Minimal Heat-Affected Zone (HAZ)
Ultrafast laser energy delivery minimizes thermal diffusion, preventing micro-cracking, recast layer buildup, and material discoloration.
Dynamic Beam Positioning
High-speed galvo scanning heads combined with multi-axis CNC motion enable rapid hole pattern drilling at rates exceeding 1,000 holes per second.
Five Core Industrial Laser Drilling Techniques
Different component geometries, hole diameters, and material thicknesses demand tailored energy delivery strategies. We configure optics and motion pathways to match your production process window.
Percussion Laser Drilling
Delivers a high-frequency train of short, high-peak-power pulses to the same spot. Material is progressively vaporized and ejected, enabling deep hole penetration in thick metals and superalloys.
Single-Shot Laser Drilling
Fires a single, high-energy laser pulse to create a hole instantaneously. Ideal for high-speed filter manufacturing, perforated sheet processing, and thin-wall tube drilling.
Trepan Laser Drilling
Combines initial laser piercing with circular beam motion along the perimeter. Produces larger diameter holes with smooth wall finishes and superior roundness control.
Helical Laser Drilling
Moves the laser beam in a three-dimensional spiral pattern with high rotational velocity. Provides extreme precision over entrance/exit taper and yields zero recast layer.
Hybrid Laser Processing
Integrates laser drilling with waterjet or coaxial gas assistance to accelerate debris evacuation, prevent surface oxidation, and process thick thermal barrier coatings (TBC).
On-The-Fly (OTF) Drilling
Synchronizes laser pulsing with continuous part movement on rotating or linear stages, dramatically reducing cycle time for cylindrical components and spin packs.
Industrial Process Comparison
Evaluation of Laser Drilling against traditional Electrical Discharge Machining (EDM), Waterjet, and Mechanical CNC drilling across core performance parameters.
| Performance Criteria | Laser Drilling (Scantech) | EDM Drilling | Waterjet Drilling | Mechanical CNC |
|---|---|---|---|---|
| Processing Speed | Ultra-High (>1000 holes/sec) | Medium | Low to Medium | Medium |
| Min Hole Diameter | Down to 10 µm | ~100 µm | ~500 µm | ~300 µm |
| Tooling & Wear Cost | Zero (Non-contact beam) | High (Electrode wear) | Medium (Nozzle/Abrasive) | High (Bit wear/Breakage) |
| Material Versatility | Metals, Ceramics, Polymers | Conductive Metals Only | Metals, Composites, Glass | Ductile Metals & Plastics |
| Heat-Affected Zone (HAZ) | Negligible (Ultrafast source) | Moderate to High | None (Cold process) | None (Mechanical friction) |
| Consumable Overhead | Low (Process gases only) | High (Dielectric fluid) | High (Garnet abrasive) | High (Drill bits & coolant) |
Engineered For Critical Global Supply Chains
Scantech Laser drilling systems are operational worldwide, supporting strict quality standard compliance in demanding high-volume manufacturing environments.
Aerospace Turbine Components
Drilling angled film cooling holes in nickel superalloy turbine blades, vanes, and combustion liners equipped with ceramic thermal barrier coatings.
Automotive Fuel Systems
High-precision micro-drilling of gasoline direct injection (GDI) and diesel injector spray nozzles for optimized fuel atomization and emission compliance.
Medical Device Micro-Vias
Creating burr-free fluid passages in catheters, hypodermic needles, bio-absorbable stents, and surgical tools under strict ISO 13485 protocols.
Electronics & Semiconductors
Micro-via drilling in printed circuit boards (PCBs), silicon wafers, alumina ceramics, and glass substrates with high position repeatability.